Light-emitting device and light-emitting system

ABSTRACT

A first electrode ( 110 ) has optical transparency, and a second electrode ( 130 ) has light reflectivity. An organic layer ( 120 ) is located between the first electrode ( 110 ) and the second electrode ( 130 ). Light-transmitting regions (a second region ( 104 ) and a third region ( 106 )) are located between a plurality of light-emitting units ( 140 ). An insulating film ( 150 ) defines the light-emitting units ( 140 ) and includes tapers ( 152, 154 ). A sealing member ( 170 ) covers the light-emitting units ( 140 ) and the insulating film ( 150 ). A low reflection film ( 190 ) is located on the side opposite to a substrate ( 100 ) with the second electrode ( 130 ) therebetween. The low reflection film ( 190 ) covers at least one portion of the tapers ( 152  and  154 ).

This application is a continuation of application Ser. No. 16/776,485filed Jan. 29, 2020, which is a continuation of application Ser. No.16/081,895 filed Aug. 31, 2018, now U.S. Pat. No. 10,580,842, which is aNational Stage Entry of International Application No. PCT/JP2016/056673filed on Mar. 3, 2016, the disclosures of which are incorporated hereinby reference in their entirety.

TECHNICAL FIELD

The present invention relates to a light-emitting device and alight-emitting system.

BACKGROUND ART

In recent years, there has been progress in the development oflight-emitting devices using organic EL. Such light-emitting devices areused as illumination devices or display devices and configured of anorganic layer interposed between a first electrode and a secondelectrode. Generally, a light-transmitting material is used for thefirst electrode, and a metal material is used for the second electrode.

One of the light-emitting devices which utilizes the organic EL is atechnology described in Patent Document 1. In order to provide anorganic EL element with optical transparency (or a “see-through”property), the technology in Patent Document 1 provides the secondelectrode only in a portion of a substrate. In such a configuration,since a region located between a plurality of second electrodestransmits light, the organic EL element is capable of having opticaltransparency.

Further, Patent Document 2 describes providing a mirror layer in aposition overlapping an active region of the organic layer in theorganic EL element in which a portion of the organic layer is aninactive region and additionally, the second electrode is provided withoptical transparency.

RELATED ART DOCUMENT Patent Document

[Patent Document 1]: Japanese Unexamined Patent Application PublicationNo. 2013-149376

[Patent Document 2]: Japanese Unexamined Patent Application Publication(Translation of PCT Application) No. 2012-506604

SUMMARY OF THE INVENTION

In a light-emitting device having optical transparency, there is a casewhere light emitted by a light-emitting unit is desired to be emittedonly from a surface (a surface on a light-emitting side). Meanwhile, thelight-emitting device utilizing organic EL includes a sealing member inorder to protect the organic layer from moisture or oxygen. Meanwhile, aportion of the light emitted from the organic layer toward the surfaceis reflected on an interface of a layer or a substrate and heads to thesealing member. A portion of this reflected light has an angle largerthan a critical angle on a surface of the sealing member, therebyfurther reflected on the surface of the sealing member and heads to asecond electrode. Here, when there is an inclined portion in the secondelectrode, an angle of the reflected light decreases at this inclinedportion, and as a result, an amount of light which is transmittedthrough the sealing member, that is, the amount of light emitted to arear surface side, increases.

An example of the problem to be solved by the present invention is toreduce an amount of light emitted to a rear surface side in alight-emitting device having optical transparency.

Means for Solving the Problem

The invention described in claim 1 is a light-emitting device including:

a light-transmitting partition member;

a plurality of light-emitting units formed on the substrate, eachlight-emitting unit including a light-transmitting first electrode, alight-reflective second electrode, and an organic layer located betweenthe first electrode and the second electrode;

a light-transmitting region located between the plurality oflight-emitting units;

an insulating film that defines the light-emitting unit and includes ataper;

a sealing member which covers the light-emitting unit and the insulatingfilm;

a low reflection film located on the opposite side of the organic layersubstrate with the second electrode put therebetween,

in which the second electrode covers at least one portion of the taper,and

in which the low reflection film overlaps the at least one portion ofthe taper.

The invention described in claim 12 is a light-emitting systemincluding:

a light-transmitting partition member that partitions a space from anexterior;

a light-transmitting substrate disposed on the partition member;

a plurality of light-emitting units formed on the substrate, eachlight-emitting unit having a light-transmitting first electrode, alight-reflective second electrode, and an organic layer located betweenthe first electrode the second electrode;

a light-transmitting region located between the plurality oflight-emitting units;

an insulating film that defines the light-emitting unit and includes ataper;

a sealing member that covers the light-emitting unit and the insulatingfilm;

a low reflection film located on the opposite side of the substrate withthe second electrode therebetween,

in which the second electrode covers at least one portion of the taper,and

in which the low reflection film overlaps the at least one portion ofthe taper.

BRIEF DESCRIPTION OF THE DRAWINGS

The objects described above, and other objects, features and advantagesare further made apparent by a suitable embodiment that will bedescribed below and the following accompanying drawings.

FIG. 1 is a plan view of a light-emitting device according to anembodiment.

FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1.

FIG. 3 is a cross-sectional view of a configuration of a light-emittingdevice according to Modification Example 1.

FIG. 4 is a cross-sectional view of a configuration of a light-emittingdevice according to Modification Example 2.

FIG. 5 is a cross-sectional view of a configuration of a light-emittingdevice according to Modification Example 3.

FIG. 6 is a cross-sectional view of a configuration of a light-emittingdevice according to Modification Example 4.

FIG. 7 is a cross-sectional view of a configuration of a light-emittingdevice according to Modification Example 5.

FIG. 8 is a cross-sectional view of a configuration of a light-emittingdevice according to a modification example of FIG. 7.

FIG. 9 is a cross-sectional view of a configuration of a light-emittingdevice according to a modification example of FIG. 7.

FIG. 10 is a cross-sectional view of a configuration of a light-emittingsystem according to Example 1.

FIG. 11 is a cross-sectional view of a configuration of a light-emittingsystem according to Example 2.

FIG. 12 is a cross-sectional view of a configuration of a light-emittingsystem according to Example 3.

FIG. 13 is a cross-sectional view of a configuration of a light-emittingsystem according to Modification Example of FIG. 12.

FIG. 14 is a cross-sectional view of a configuration of a light-emittingsystem according to Example 4.

FIG. 15 is a cross-sectional view of a configuration of a light-emittingsystem according to Example 5.

FIG. 16 is a cross-sectional view of a configuration of a light-emittingsystem according to Example 6.

DESCRIPTION OF EMBODIMENTS

An embodiment of the present invention will be described below byreferring to the drawings. Moreover, in all the drawings, the sameconstituent elements are given the same reference numerals, anddescriptions thereof will not be repeated.

(Embodiment)

FIG. 1 is a plan view of a configuration of a light-emitting device 10according to an embodiment. FIG. 2 is a cross-sectional view taken alongline A-A of FIG. 1. The light-emitting device 10 according to theembodiment includes a substrate 100, a plurality of light-emitting units140, a light-transmitting region (a second region 104 and a third region106), an insulating film 150, a sealing member 170, and a low reflectionfilm 190. Each of the plurality of light-emitting units 140 includes afirst electrode 110, an organic layer 120, and a second electrode 130.The first electrode 110 is light-transmitting, and the second electrode130 has light reflectivity. Further, the organic layer 120 is locatedbetween the first electrode 110 and the second electrode 130. Thelight-transmitting region (the second region 104 and the third region106) is located between the plurality of light-emitting units 140. Theinsulating film 150 defines the light-emitting units 140 and includestapers 152 and 154. The sealing member 170 covers the light-emittingunits 140 and the insulating film 150. The low reflection film 190 islocated on the opposite side of the substrate 100 with the secondelectrode 130 located therebetween. The second electrode 130 covers atleast a portion of the tapers 152 and 154. Therefore, a portion of asurface of the second electrode 130 on the side opposite the substrate100 is inclined. In addition, the low reflection film 190 covers atleast the portion of the tapers 152 and 154. In other words, the lowreflection film 190 covers the portion which inclines in the secondelectrode 130. A detailed description on the light-emitting device 10will be provided below.

The substrate 100 is a substrate, such as, for example, a glasssubstrate or a resin substrate which has optical transparency. Thesubstrate 100 may have flexibility. In a case where the substrate hasflexibility, the thickness of the substrate 100 is, for example, equalto or greater than 10 μm and equal to or less than 1,000 μm. Thesubstrate 100 is polygonal, for example, rectangular, or round. In acase where the substrate 100 is a resin substrate, the substrate 100 isformed using, for example, polyethylene naphthalate (PEN), polyethersulphone (PES), polyethylene terephthalate (PET), or polyimide. Inaddition, in a case where the substrate 100 is a resin substrate, aninorganic barrier film of SiN_(x), SiON or the like is formed on atleast one surface (preferably, both surfaces) of the substrate 100 inorder to prevent moisture from permeating the substrate 100. Thisinorganic barrier film is formed, for example, by sputtering, CVD, orALD. Meanwhile, in a case where the substrate 100 is a resin substrate,methods of forming the light-emitting device 10 include directlydepositing the first electrode 110 and the organic layer 120 on theresin substrate, to be described later, forming the first electrode 110and layers that follow directly on a glass substrate, peeling the firstelectrode 110 from the glass substrate, and thereafter, placing thepeeled laminate on a resin substrate.

The light-emitting unit 140 is formed on a second surface 100 b of thesubstrate 100. The light-emitting unit 140 has a configuration in whichthe first electrode 110, the organic layer 120 including alight-emitting layer, and the second electrode 130 are laminated in thisorder. In addition, a first surface 100 a of the substrate 100 is asurface from which light is emitted.

The first electrode 110 is a transparent electrode which has opticaltransparency. A material of the transparent electrode is a materialcontaining a metal, for example, a metal oxide such as an indium tinoxide (ITO), an indium zinc oxide (IZO), an indium tungsten zinc oxide(IWZO), a zinc oxide (ZnO), or the like. The thickness of the firstelectrode 110 is, for example, equal to or greater than 10 nm and equalto or less than 500 nm.

The first electrode is formed by, for example, sputtering or vapordeposition. Moreover, the first electrode 110 maybe a conductive organicmaterial such as carbon nanotubes or PEDOT/PSS. Further, the firstelectrode 110 may have a laminated structure in which a plurality oflayers are laminated. In the diagram, a plurality of rectangular shaped(stripe patterned) first electrodes 110 are formed in parallel to eachother on the substrate 100. Thus, the first electrode 110 is not locatedin the later described second region 104 and the third region 106.

The organic layer 120 has a structure composed of, for example, a holeinjection layer, a light emitting layer, and an electron injectionlayer, laminated in this order. The hole transporting layer may beformed between the hole injection layer and the light emitting layer.Moreover, an electron transporting layer may be formed between the lightemitting layer and the electron injection layer. The organic layer 120may be formed by vapor deposition. Also, at least one layer in theorganic layer 120, for example, a layer in contact with the firstelectrode 110, maybe formed by coating, such as ink jetting, printing,or spraying. In this case, the rest of the layers in the organic layer120 are formed by vapor deposition. Moreover, all layers of the organiclayer 120 may be formed by coating. Meanwhile, instead of the organiclayer 120, another light-emitting layer (for example, an inorganiclight-emitting layer) may be included. Further, a luminescent colorradiated by the light-emitting layer (or a color of light emitted fromthe organic layer 120) maybe different from the luminescent color (orthe color of the light emitted from the organic layer 120) of thelight-emitting layer of an adjacent light-emitting unit 140.

The second electrode 130 has light reflectivity and includes a metallayer composed of a metal selected from a first group including, forexample, Al, Au, Ag, Pt, Mg, Sn, Zn, and In, or an alloy of metalsselected from the first group. The thickness of the second electrode 130is, for example, equal to or greater than 10 nm and equal to or lessthan 500 nm. However, the second electrode 130 may be formed using amaterial exemplified as the material of the first electrode 110. Thesecond electrode 130 is formed by, for example, sputtering or vapordeposition. In the example shown in the drawing, the light-emittingdevice 10 includes a plurality of linear second electrodes 130. Thesecond electrode 130 is provided per each of the first electrodes 110,and a width thereof is wider than that of the first electrode 110.Therefore, in a case where viewed from a direction perpendicular to thesubstrate 100, in a width direction, the entirety of the first electrode110 is overlapped and covered by the second electrode 130. By adoptingsuch configuration, an extraction direction of the light emitted by thelight-emitting layer of the organic layer 120 may be adjusted.Specifically, emission of the light to the opposite side of the firstsurface 100 a of the light-emitting device 10 may be inhibited.

The edge of the first electrode 110 is covered by an insulating film150. The insulating film 150 is formed of, for example, a photosensitiveresin material such as polyimide and surrounds a portion of the firstelectrode 110 serving as the light emitting unit 140. A surface of theinsulating film 150 includes the taper 152 (a first taper) and the taper154 (a second taper). The taper 152 faces the light-emitting unit 140and the taper 154 faces a light transmitting region (the second region104 and the third region 106).

The second electrode 130 covers at least the taper 152. A portion of thesurface of the second electrode 130 on the side opposite from thesubstrate 100 includes a taper. Further, an edge of the second electrode130 in the width direction is located above the insulating film 150,however, at least a half of the taper 154 is left uncovered by thesecond electrode 130. However, a location of the edge of the secondelectrode 130 is not limited to an example shown in the drawing. Inaddition, in the example shown in the drawing, the organic layer 120 isalso formed on top and side of the insulating film 150. The organiclayer 120 is preferably electrically separated between thelight-emitting units 140 next to each other but may be formedcontinuously with the light-emitting units 140 next to each other.

The light-emitting device 10 further includes the low reflection film190. The low reflection film 190 is located on the opposite side of thesubstrate 100 (the upper side in FIG. 2) with the second electrode 130disposed therebetween. In the example shown in FIG. 2, the lowreflection film 190 is formed on the second electrode 130 (on thesurface of the second electrode on the sealing member 170 side). Inother words, the low reflection film 190 touches the surface of thesecond electrode 130 on the side opposite the substrate 100.

The low reflection film 190 is formed using a material having lowreflectance, for example, a material whose reflectance of light is lowerthan that of the second electrode 130. Examples of such materialincludes materials containing Cr, Ni, Mo, carbon black, or titan black.The low reflection film 190 may be a single layer film or may be alaminated film in which plural layers are laminated. In the latter case,at least one film may be formed using a material different from that ofanother film. Such a laminated film includes, for example, a laminatedfilm of a chromium oxide film and a chromium film. Further, the lowreflection film 190 may be formed using an organic material containing ablack pigment. The thickness of the low reflection film 190 isdetermined so that, for example, the visible light reflectance ofvisible light of the low reflection film 190 is equal to or less than50%.

The low reflection film 190 covers at least the taper 152. In otherwords, when viewed in a direction perpendicular to the substrate 100,the low reflection film 190 overlaps the taper 152.

Meanwhile, the low reflection film 190 preferably covers the taper 152and a region located around the taper 152. In the example shown in FIG.2, the width of the light-emitting unit 140 is defined by two insulatingfilms 150. Further, each of the two insulating films 150 includes thetaper 152 and the taper 154. The low reflection film 190 covers thelight-emitting unit 140 and the two tapers 152.

As described above, in the example shown in FIG. 2, an edge portion ofthe second electrode 130 is located above the insulating film 150.Further, in the width direction of the light-emitting unit 140, an edgeof the low reflection film 190 is located above the second electrode130. In other words, in the width direction of the light-emitting unit140, the edge portion of the second electrode 130 is exposed from thelow reflection film 190.

The low reflection film 190 is formed by, for example, sputtering usinga mask, vapor deposition using a mask, or screen printing. In a casewhere the low reflection film 190 and the second electrode 130 areformed using the same manufacturing method (for example, vacuumdeposition), the second electrode 130 and the low reflection film 190may be formed continuously. For example, the second electrode 130 andthe low reflection film 190 may be formed using the same mask in thesame processing vessel. In addition, the processing vessel to form thesecond electrode 130 and the processing vessel to form the lowreflection film 190 maybe connected to each other through a conveyancepath in a vacuum state.

When viewed in a direction perpendicular to the substrate 100, theplurality of light-emitting units 140 extend in parallel to one another.In the example shown in FIG. 1, all of the plurality of light-emittingunits 140 extend in rectangular shapes (in a striped pattern). However,the light-emitting units 140 may bend in the middle.

When viewed in a direction perpendicular to the substrate 100, thesubstrate 100 includes the first region 102, the second region 104 andthe third region 106. The first region 102 overlaps the second electrode130. When the second electrode 130 has light shielding properties, thefirst region 102 does not transmit light either from a front surface toa rear surface or from the rear surface to the front surface of thelight-emitting device 10 or the substrate 100. The second region 104does not overlap the second electrode 130 but overlaps the insulatingfilm 150. The third region 106 neither overlaps the second electrode 130nor the insulating film 150. In addition, since the width of the secondregion 104 is narrower than that of the third region 106, thelight-emitting device 10 includes sufficient optical transparency.

In the example shown in the drawing, the organic layer 120 is alsoformed in the second region 104 and the third region 106. In otherwords, the organic layer 120 of the plurality of the light-emittingunits 140 are formed continuously. However, the organic layer 120 is notrequired to be formed in the third region 106. In addition, the organiclayer 120 is not required to be formed in the second region 104.

The width of the second region 104 is narrower than that of the thirdregion 106. Further, the width of the third region 106 may be wider ornarrower than that of the first region 102. In a case where the width ofthe first region 102 is 1, the width of the second region 104 is, forexample, equal to or greater than 0 (or more than 0 or equal to orgreater than 0.1) and equal to or less than 0.2, and the width of thethird region 106 is, for example, equal to or greater than 0.3 and equalto or less than 2. Further, the width of the first region 102 is, forexample, equal to or greater than 50 μm and equal to or less than 500μm, the width of the second region 104 is, for example, equal to orgreater than 0 μm (or more than 0 μm) and equal to or less than 100 μm,and the width of the third region 106 is, for example, equal to orgreater than 15 μm and equal to or less than 1,000 μm.

The light-emitting device 10 includes the sealing member 170. Thesealing member 170 is, for example, a plate like member formed of resin,and includes a barrier film 172 (for example, an inorganic film) on atleast one surface (preferably both surfaces) thereof. In this case, theresin which configures the sealing member 170 is, for example,polyethylene naphthalate (PEN), polyether sulphone (PES), polyethyleneterephthalate (PET), or polyimide. Further, the barrier film 172 is, forexample, SiN_(x) or SiON, and formed by, for example, sputtering, CVD,or ALD. The sealing member 170 is fixed to the second surface 100 b ofthe substrate 100, by using, for example, an insulating layer 174 (forexample an adhesive layer or a pressure-sensitive adhesive layer).Meanwhile, at least a portion of the insulating layer 174 may be incontact with the second electrode 130.

Next, the manufacturing method of the light-emitting device 10 isdescribed. First, the first electrode 110 is formed on the secondsurface 100 b of the substrate 100. Next, the insulating film 150 isformed, and then, the organic layer 120, the second electrode 130 andthe low reflection film 190 are further formed in this order.Thereafter, by using the insulating layer 174, the sealing member 170 isfixed to the second surface 100 b of the substrate 100.

Since the second electrode 130 has light reflectivity, the light emittedby the light-emitting unit 140 is emitted to the outside of thelight-emitting unit 140 through the first electrode 110. Here, betweenthe first electrode 110 and the first surface 100 a of the substrate100, there are a plurality of interfaces (for example, the interfacebetween the first electrode 110 and the substrate 100, and the interfacebetween the substrate 100 and the outside). Therefore, a portion of thelight from the light-emitting unit 140 is reflected since the anglethereof is greater than the critical angle of these interfaces. In acase where all of the interfaces are substantially parallel, the angleof the reflected light does not change. However, as shown in the presentembodiment, in a case where a portion of the insulating film 150 servesas the taper 152, a portion overlapping the taper 152 in the secondelectrode 130 includes a taper. When reflective light is incident on theportion of the second electrode 130 having the taper, the angle of thereflected light becomes small when the reflected light is furtherreflected on the taper. Therefore, there is a possibility that theaforementioned reflected light is emitted to the rear surface side (theupper side in FIG. 2) of the light-emitting device 10.

In contrast, in the present embodiment, the low reflection film 190 islocated on a side opposite from the substrate 100 with the secondelectrode 130 disposed therebetween and overlaps the taper 152 of theinsulating film 150. Therefore, it is possible to inhibit reflectivelight from being incident on the taper of the second electrode 130, andas a result, it is possible to inhibit light emitted by thelight-emitting unit 140 from being emitted to the rear side of thelight-emitting device 10 by the aforementioned mechanism. In particular,in the example shown in FIG. 2, the low reflection film 190 is incontact with the surface of the second electrode 130 on the sideopposite from the substrate 100. Therefore, it is possible tosufficiently inhibit reflective light from being incident on the taperof the second electrode 130. Thus, a possibility of the reflected lightleaking to the rear surface side (the upper side in FIG. 2) of thelight-emitting device 10 can be reduced.

In addition, since it is possible to inhibit incident light from therear surface side of the light-emitting device 10 from being reflectedon the second electrode 130, compared to a case where the low reflectionfilm 190 is not provided, it is possible to make a person recognize anincrease in the light-transmittance of the light-emitting device 10. Inaddition, when the low reflection film 190 covers the light-emittingunit 140, even in a case where a pinhole is formed in the secondelectrode 130, it is possible to block the pinhole with the lowreflection film 190. Therefore, it is possible to inhibit moisture orthe like from infiltrating the organic layer 120 from the secondelectrode 130 side.

Modification Example 1

FIG. 3 is a cross-sectional view of a configuration of a light-emittingdevice 10 according to Modification Example 1 and corresponds to FIG. 2of the embodiment. The light-emitting device 10 according to the presentmodification example has the same configuration as that of thelight-emitting device 10 according to the embodiment, except that thelow reflection film 190 covers both of the taper 152 (a first taper) andthe taper 154 (a second taper) of the insulating film 150.

In detail, an end of the low reflection film 190 is further separatedfrom the light-emitting unit 140 than an end of the second electrode130. In other words, the low reflection film 190 covers the entiresecond electrode 130 in the width direction of the light-emitting unit140. In the example shown in the drawing, the end of the low reflectionfilm 190 is located above a side face of the insulating film 150 on thethird region 106 side. However, at least one of the ends of the lowreflection film 190 may be located in the third region 106.

In the present modification example also, the same as the embodiment, apossibility of light leakage to a rear surface side of thelight-emitting device 10 can be reduced. Further, the low reflectionfilm 190 also covers the taper 154 of the insulating film 150.Therefore, it is possible to sufficiently inhibit reflected light frombeing incident on a taper of the second electrode 130. Thus, thepossibility of the reflected light leaking to a rear surface side of thelight-emitting device 10 can be reduced.

Modification Example 2

FIG. 4 is a cross-sectional view of a configuration of a light-emittingdevice 10 according to Modification Example 2 and corresponds to FIG. 2of the embodiment. The light-emitting device 10 according to the presentmodification example has the same configuration as that of thelight-emitting device 10 according to the Modification Example 1 exceptthat the first electrode 110 is formed in all of the first region 102,the second region 104, and the third region 106. In other words, thefirst electrodes 110 of the respective ones of the plurality of thelight-emitting units 140 are connected to each other.

In the present modification example also, the same as ModificationExample 1, a possibility of light leakage to a rear surface side of thelight-emitting device 10 can be reduced. Meanwhile, in thelight-emitting device 10 according to the embodiment, the firstelectrode 110 may have the same configuration as that of the presentmodification example. In this case, the same as the present modificationexample, the possibility of the reflected light leaking to the rearsurface side of the light-emitting device 10 can be further reduced.

Modification Example 3

FIG. 5 is a cross-sectional view of a configuration of a light-emittingdevice 10 according to Modification Example 3 and corresponds to FIG. 2of the embodiment. The light-emitting device 10 according to the presentexample has the same configuration as that of the light-emitting device10 according to Modification Example 1, except that the organic layer120 is divided between light-emitting units 140 next to each other. Theorganic layer 120 is not formed in, for example, a portion of, or theentire portion of the third region 106. The organic layer 120 is notrequired to be formed in the second region 104 on the side of the thirdregion 106. However, the organic layer 120 may be formed in the secondregion 104 and the third region 106 on the second region 104 side.

In the present modification example also, the same as ModificationExample 1, a possibility of light leakage to a rear surface side of thelight-emitting device 10 can be reduced.

Meanwhile, in the light-emitting device 10 according to the embodimentor Modification Example 2, the organic layer 120 may have the sameconfiguration as that of the present modification example.

Modification Example 4

FIG. 6 is a cross-sectional view of a configuration of a light-emittingdevice 10 according to Modification Example 4 and corresponds to FIG. 2of the embodiment. The light-emitting device 10 according to the presentmodification example has the same configuration as that of thelight-emitting device 10 according to the Modification Example 1, exceptthat the first electrode 110 includes a conductive layer 180. Theconductive layer 180 is an auxiliary electrode of the first electrode110, and includes a laminated structure of, for example, a Mo alloylayer, an Al alloy layer, and a Mo alloy layer laminated in this order.The conductive layer 180 may also be formed using an Ag alloy. Theconductive layer 180 is formed on a portion of the first electrode 110covered by the insulating film 150. However, the conductive layer 180maybe formed between the first electrode 110 and the substrate 100 (orbetween the first electrode 110 and an optical function layer 160).

In the present modification example also, the same as ModificationExample 1, a possibility of light leakage to a rear surface side of thelight-emitting device 10 can be reduced. Meanwhile, the light-emittingdevice 10 according to any of the embodiment and Modification Examples 2to 3 may be provided with the conductive layer 180.

Modification Example 5

FIG. 7 is a cross-sectional view of a configuration of a light-emittingdevice 10 according to Modification Example 5 and corresponds to FIG. 2of the embodiment. The light-emitting device 10 according to the presentmodification example has the same configuration as that of thelight-emitting device 10 according to the embodiment, except for thelocation of the low reflection film 190 in the thickness direction ofthe light-emitting device 10.

In the present modification example, the low reflection film 190 islocated between a barrier film 172 of a sealing member 170 on thesubstrate 100 side and the insulating layer 174. In other words, the lowreflection film 190 is formed on a surface of the sealing member 170 onthe substrate 100 side (in particular, on the barrier film 172). Whenviewed in a direction perpendicular to the substrate 100, a region inwhich the insulating film 150 and the second electrode 130 overlap withthe low reflection film 190 is the same as the embodiment. Further, aformation method and a material of the low reflection film 190 are asdescribed in the embodiment.

Meanwhile, as illustrated in FIG. 8, the low reflection film 190 may beformed on the sealing member 170 on a surface opposite from thesubstrate 100 (in particular, on the barrier film 172). In addition, asillustrated in FIG. 9, the low reflection film 190 may be formed on theboth sides of the sealing member 170.

In the present modification example also, the same as the embodiment, apossibility of light leakage to a rear surface side of thelight-emitting device 10 can be reduced. Meanwhile, the light-emittingdevice 10 according to any of Modification Examples 1 to 4, the lowreflection film 190 may be disposed in the same location as the presentmodification example.

EXAMPLE 1

FIG. 10 is a cross-sectional view of a configuration of a light-emittingsystem according to Example 1. This light-emitting system includes alight-emitting device 10 and a partition member 20. The partition member20 includes optical transparency and partitions a space from theexterior thereof. This space is, for example, a space occupied by aperson, or a space having an object such as a commercial productdisposed therein. The light-emitting device 10 includes the sameconfiguration as that of any of above mentioned embodiments andmodification examples. In the example shown in the drawing, a surface ofthe substrate 100 on the side provided with the light-emitting unit 140(a second surface 100 b) is directed toward the space occupied by aperson.

The partition member 20 is, for example, a window of a mobile object 30for transporting a person, or a window of a showcase, and is formedusing glass or a light-transmitting resin. The mobile object 30 is, forexample, an automobile, a train, or an airplane. Ina case where themobile object 30 is an automobile, the partition member 20 is awindshield, a rear windshield, or a side window (for example, a doorwindow) installed at the side of a seat. In a case where the partitionmember 20 is a rear windshield, the plurality of light-emitting units140 function as, for example, a brake light. In addition, in a casewhere the partition member 20 is a windshield or a rear windshield, theplurality of light-emitting units 140 may be a turn signal light. Inaddition, the partition member 20 may be a window for partitioning theinterior and the exterior of a room such as a meeting room. Thelight-emitting system may allow to distinguish whether the meeting roomis occupied, depending on the lighting/non-lighting of thelight-emitting unit 140. The partition member 20 may be inclined by anangle θ (for example, larger than 45 degrees and smaller than 90degrees) with respect to a horizontal plane or may be vertical (0 is 90degrees) with respect to the horizontal plane.

Further, a first surface 100 a of the light-emitting device 10, that is,a surface on a light extraction side, is fixed to an inner surface (afirst surface 22) of the partition member 20 with an adhesive layer 200interposed therebetween. Therefore, light emitted from thelight-emitting unit 140 of the light-emitting device 10 is emitted tothe exterior of the above-mentioned space (for example, the mobileobject 30) through the partition member 20. Further, the light-emittingdevice 10 has optical transparency. Therefore, a person can view theexterior and the interior of the space through the partition member 20.For example, a person inside the mobile object 30 is able to view theexterior of the mobile object 30 through the partition member 20.Meanwhile, the entirety of the first surface 100 a of the substrate 100may be fixed to the first surface 22 of the partition member 20 with theadhesive layer 200 interposed therebetween, or a portion (for example,two sides facing each other) of the first surface 100 a maybe fixed tothe first surface 22 of the partition member 20.

The adhesive layer 200 fixes the light-emitting device 10 to thepartition member 20. As long as a material fulfilling such a function isused, there is no particular limitation to the material. In addition, ina case where a refractive index of the partition member 20 and that ofthe substrate 100 of the light-emitting device 10 are substantially thesame, such as, for example, a case where both the partition member 20and the substrate 100 are formed of glass, a material having therefractive index the same as or close to those of the both is used asthe adhesive layer 200. In addition, in a case where the partitionmember 20 and the substrate 100 are different from each other inrefractive indexes (for example, the partition member 20 is formed ofplastic, and the substrate 100 is formed of glass), the refractive indexof the adhesive layer 200 is preferably a numerical value between therefractive index of the partition member 20 and the refractive index ofthe substrate 100. With such a configuration, light emitted from thelight-emitting device 10 can be efficiently extracted to the outsidethrough the partition member 20. In addition, the light-emitting device10 and the partition member are preferably bonded to each other withoutany gaps therebetween, since if there is a gap, light emitted from thelight-emitting device 10 is reflected by the partition member 20, andthe reflected light is transmitted to the inside through the secondregion 104 and the third region 106.

The light-emitting device 10 has a configuration shown in any of theembodiment and each modification example. Therefore, a possibility oflight leakage to a rear surface side (the right side in FIG. 10) of thelight-emitting device 10 can be reduced.

EXAMPLE 2

FIG. 11 is a cross-sectional view of a configuration of a light-emittingsystem according to Example 2. The light-emitting system according tothe present example has the same configuration as that of thelight-emitting system according to the Example 1, except that thelight-emitting device 10 is mounted on the partition member 20 on anouter surface (a second surface 24) of the mobile object 30.

The light-emitting device 10 according to the present example has aconfiguration shown in any of the embodiments and each modificationexample. However, in this light-emitting device 10, the surface thereofon the opposite side of the partition member 20 serves as the lightextraction surface. In order to achieve such configuration, the secondsurface 100 b of the light-emitting device 10 may be made to face thepartition member 20.

In the present example also, the same as Example 1, a possibility oflight leakage to a rear surface side of the light-emitting device 10 canbe reduced.

In addition, the light emitted from the light-emitting device 10 isemitted directly to the exterior of the mobile object 30 without passingthrough the partition member 20. Therefore, compared to the embodiment,a person who is outside the mobile object 30 can easily recognize thelight from the light-emitting device 10. In addition, since thelight-emitting device 10 is installed on the exterior of the mobileobject 30, that is, on the partition member 20 on the second surface 24side, it is possible to prevent the light from the light-emitting device10 from being reflected by the partition member 20 and entering theinterior of the mobile object 30.

EXAMPLE 3

FIG. 12 is a cross-sectional view of a configuration of a light-emittingsystem according to Example 3. The light-emitting system according tothe present example has the same configuration as that of thelight-emitting system according to Example 1, except that thelight-emitting device 10 is fixed to the partition member 20 usingfixing members 210.

The fixing member 210 is a frame-like member with a lower surfacethereof fixed to the partition member 20 using an adhesive layer 200. Anupper portion of the fixing member 210 is bent to the inside of thefixing member 210, and this bent portion holds an edge of thelight-emitting device 10. However, the shape of the fixing member 210 isnot limited to the example shown in the drawing.

In the present example also, the same as Example 1, a possibility oflight leakage to a rear surface side of the light-emitting device 10 canbe reduced.

In addition, as shown in FIG. 13, there is a case where the partitioningmember 20 maybe curved in a direction projecting to the outside of themobile object 30. In such a case, it is difficult to fix the flatplate-shaped light-emitting device 10 directly to an inner surface (afirst surface 22) of the partition member 20. However, use of the fixingmember 210 allows the light-emitting device 10 to be fixed to the firstsurface 22 of the partition member 20 even in such circumstances.

In a case where the curved partition member 20 and the flat plate-shapedlight-emitting device 10 are fixed to each other in the above manner, afiller may be filled into a gap between the partition member 20 and thelight-emitting device 10. As described above, if there is a gap presenttherebetween, light emitted from the light-emitting device 10 isreflected by the partition member 20, and the reflected light istransmitted to the interior through a third region 106 of thelight-emitting device 10. When the refractive index of the partitionmember 20 and the refractive index of a substrate 100 of thelight-emitting device 10 are substantially the same as each other (forexample, when both are formed of glass), the refractive index of afilling member is preferably a value which is the same as or close tothese refractive indexes. In addition, when the partition member 20 andthe substrate 100 are different from each other in refractive indexes(for example, the partition member 20 is formed of plastic while thesubstrate 100 is formed of glass), the refractive index of the filler ispreferably a numerical value between the refractive index of thepartition member 20 and the refractive index of the substrate 100 of thelight-emitting device 10.

EXAMPLE 4

FIG. 14 is a cross-sectional view of a configuration of a light-emittingsystem according to Example 4. The light-emitting system according tothe present example has the same configuration as that of thelight-emitting system according to Example 1, except that thelight-emitting unit 140 is formed on the first surface 22 or the secondsurface 24 of the partition member 20. In other words, in the presentexample, the partition member 20 also serves as the substrate 100 inExample 1.

Meanwhile, in the present example, a concave portion is formed on asurface of the partition member 20 on which the light-emitting unit 140is formed, and the light-emitting unit 140 may be formed in this concaveportion. For example, one concave portion may be formed in a region inwhich the plurality of light-emitting units 140 are formed, and theplurality of light-emitting units 140 may be formed on a bottom surfaceof the concave portion. Alternatively, a concave portion may beindividually formed for each of the plurality of light-emitting units140. In this case, sealing of the light-emitting units 140 may beconfigured to seal the plurality of concave portions at a time using,for example, film sealing or the like with high optical transparency.The light-emitting units 140 may be prevented from protruding from thepartition member 20 in either case of an individual concave portionbeing formed for each light emitting unit 140 or one concave portionbeing formed for the plural light emitting units 140. Meanwhile, in acase where the light-emitting unit(s) 140 are formed in the concaveportion(s) of the partition member 20, upper parts of the light-emittingunits 140 may be projected from the first surface 22 (or the secondsurface 24) of the partition member 20, or the light-emitting units 140may be located entirely below the first surface 22 (or the secondsurface 24).

In the present example also, the same as Example 1, a possibility oflight leakage to a rear surface side of the light-emitting device 10 canbe reduced.

EXAMPLE 5

FIG. 15 is a cross-sectional view of a configuration of a light-emittingsystem according to Example 5. The light-emitting system according tothe present example has the same configuration as that of any of theembodiments, each modification example, and Examples 1 to 4 describedabove, except that a plurality of the light-emitting devices 10 areinstalled on the partition member 20. Turning on and off of the lightsof the plurality of light-emitting devices 10 may be controlled inaccordance with control signals that are the same or different from eachother.

In the present example also, the same as Example 1, a possibility oflight leakage to a rear surface side of the light-emitting device 10 canbe reduced.

EXAMPLE 6

FIG. 16 is a cross-sectional view of a configuration of a light-emittingsystem according to Example 6. The light-emitting system according tothe present example has the same configuration as that of thelight-emitting system according to Example 1, except for theconfiguration of the partition member 20 and the position of thelight-emitting device 10.

In the present example, the partition member 20 has the configuration inwhich a plurality of light-transmitting members 21 (for example, glassplates or resin plates) overlap each other. Further, the light-emittingdevice 10 is installed in the partition member 20 by being interposedbetween the light-transmitting members 21 next to each other.

In the present example also, the same as Example 1, a possibility oflight leakage to a rear surface side of the light-emitting device 10 canbe reduced.

As described above, although the embodiments and examples of the presentinvention have been set forth with reference to the accompanyingdrawings, they are merely illustrative of the present invention, andvarious configurations other than those stated above can be adopted.

1. A light-emitting device comprising: a light-transmitting substrate; aplurality of light-emitting units formed on the substrate, eachlight-emitting unit comprising a light-transmitting first electrode, alight-reflective second electrode, and an organic layer located betweenthe first electrode and the second electrode; a light-transmittingregion located between the second electrodes of the plurality oflight-emitting units; a sealing member that covers the light-emittingunit; and a low reflection film located on an opposite side of thesubstrate with the second electrode there between, wherein the lowreflection film comprises an inclined portion, and is located on asurface of the second electrode on the sealing member side.
 2. Thelight-emitting device according to claim 1, wherein the sealing memberis fixed to the light-emitting unit directly or through an adhesivelayer.
 3. The light-emitting device according to claim 1, wherein theplurality of light-emitting units extend in a same direction as eachother when viewed from a direction perpendicular to the substrate. 4.The light-emitting device according to claim 1, further comprising aninsulating film that defines the light-emitting unit and comprises ataper, wherein the second electrode covers at least one portion of thetaper, wherein the insulating film comprises a first taper that facesthe light-emitting unit, and wherein the low reflection film covers thefirst taper.
 5. The light-emitting device according to claim 4, whereinthe insulating film comprises a second taper that faces thelight-transmitting region, and wherein the low reflection film coversthe first taper and the second taper.
 6. The light-emitting deviceaccording to claim 1, wherein the low reflection film comprises amaterial having a reflectance lower than that of the second electrode.7. The light-emitting device according to claim 6, wherein the lowreflection film comprises a material containing Cr, Ni, Mo, carbonblack, or titanium black.
 8. A light-emitting system comprising: apartition member that partitions a space from an exterior; alight-transmitting substrate disposed on the partition member; aplurality of light-emitting units formed on the substrate, eachlight-emitting unit comprising a light-transmitting first electrode, alight-reflective second electrode, and an organic layer located betweenthe first electrode and the second electrode; a light-transmittingregion located between the second electrodes of the plurality oflight-emitting units; a sealing member that covers the light-emittingunit, and a low reflection film located on an opposite side of thesubstrate with the second electrode there between, wherein the lowreflection film comprises an inclined portion and is located on asurface of the second electrode on the sealing member side.
 9. Thelight-emitting system according to claim 8, wherein the sealing memberis fixed to the light-emitting unit directly or through an adhesivelayer.
 10. The light-emitting system according to claim 8, wherein theplurality of light-emitting units extend in a same direction as eachother when viewed from a direction perpendicular to the substrate. 11.The light-emitting system according to claim 8, further comprising aninsulating film that defines the light-emitting unit and comprises ataper, wherein the second electrode covers at least one portion of thetaper, wherein the insulating film comprises a first taper that facesthe light-emitting unit, and wherein the low reflection film covers thefirst taper.
 12. The light-emitting system according to claim 11,wherein the insulating film comprises a second taper that faces thelight-transmitting region, and wherein the low reflection film coversthe first taper and the second taper.
 13. The light-emitting systemaccording to claim 8, wherein the low reflection film comprises amaterial having a reflectance lower than that of the second electrode.14. The light-emitting system according to claim 13, wherein the lowreflection film comprises a material containing Cr, Ni, Mo, carbonblack, or titanium black.